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The Dell PowerEdge R570 is a powerful 2U, single-socket rack server designed to deliver high performance while maintaining exceptional energy efficiency. Its advanced design helps drive cost savings and improve data center productivity. This makes it perfect for workloads like virtualization, medium-density VMs, scale-out databases, VDI, and software-defined storage.
Max Performance:
The PowerEdge R570 seamlessly integrates into current environments. Designed for diverse performance and expandability needs, it is powered by an Intel® Xeon® 6
processor and offers advanced GPU support. This boosts computational capabilities and accelerates inferencing power, making it suitable for demanding business applications.
Air-cooled at peak performance
The server is available in rear I/O hot aisle and front I/O cold aisle configurations. The front I/O cold aisle option enhances serviceability, reduces maintenance downtime, and improves overall system reliability.
Cyber Resilient Architecture for Zero Trust IT environment & operations
The Silicon-based root of trust anchors end-to-end boot resilience while Multi-Factor
Authentication (MFA) and role-based access controls safeguard trusted operations.
Intel Xeon 6th Gen
The Intel® Xeon® 6 series of processors offers both E-Core and P-Core processors. Mixing of CPUs is not supported.
Cooling Options
High-Performance (Silver) Fan
- Supports up to 4 set high-performance silver (HPR SLVR) hot-swappable cooling fans, each consisting of a dual fan module.
High-Performance (Gold) Fan
- Supports up to 6 set Standard (STD) hot-swappable cooling fans, each consisting of a dual fan module.
Rear Drive Cage E3.S Fan
- Supports 1 fan to cool the rear drive down.
Memory Options
The Dell PowerEdge R570 holds up to 16x DDR5 DIMMs
| DIMM type |
Rank |
Capacity |
DIMM voltage and speed |
E-core processor |
P-core processor |
|
|
|
|
1 DIMM per channel (DPC) |
2 DIMM per channel (DPC) |
1 DIMM per channel (DPC) |
2 DIMM per channel (DPC) |
| RDIMM |
1R |
16 GB |
DDR5 (1.1 V), 6400 MT/s |
N/A |
N/A |
Up to 6400 MT/s |
N/A |
| 2R |
32 GB |
DDR5 (1.1 V), 6400 MT/s |
Up to 6400 MT/s |
N/A |
Up to 6400 MT/s |
Up to 5200 MT/s |
| 64 GB |
DDR5 (1.1 V), 6400 MT/s |
Up to 6400 MT/s |
Up to 5200 MT/s |
Up to 6400 MT/s |
Up to 5200 MT/s |
| 96 GB |
DDR5 (1.1 V), 6400 MT/s |
N/A |
N/A |
Up to 6400 MT/s |
Up to 5200 MT/s |
| 128 GB |
DDR5 (1.1 V), 6400 MT/s |
N/A |
N/A |
Up to 6400 MT/s |
Up to 5200 MT/s |
| 8R |
256 GB |
DDR5 (1.1 V), 6400 MT/s |
N/A |
N/A |
N/A |
Up to 5200 MT/s |
Storage Controllers (Internal)
Riser Configurations
The system supports either Front I/O configuration (system with front risers) or Rear I/O configuration (system with rear risers).
| Config No. |
Riser configuration |
No. of Processors |
PERC type supported |
Rear storage possible |
| RC 0 |
NO RSR |
1 |
Front PERC |
No |
| RC 1 |
R1x+R2t+R3e+R4b+R5b |
1 |
Front PERC |
No |
| RC 2 |
RF2a+RF4b |
1 |
N/A |
No |
| RC 3 |
RF1a+RF3c |
1 |
N/A |
No |
| RC 4 |
RF1a+RF2a+RF3d+RF4a |
1 |
N/A |
No |
| RC 5 |
R3f+R4b+R5b |
1 |
Front PERC |
No |
| RC 6 |
R1x+R3b+R4b+R5b |
1 |
N/A |
No |
| RC 7 |
R3f+R4b+R5b |
1 |
PERC Adapter |
Yes |
| RC 8 |
RF1a+RF4c+R1x+R3b+R5b |
1 |
N/A |
No |
| RC 9 |
R4b+R5b |
1 |
Front PERC |
No |
| RC 10 |
R2t+R3e+R4b+R5b |
1 |
PERC Adapter |
No |
| RC 11 |
R3e+R4b+R5b |
1 |
N/A |
No |
Intel Xeon 6 processor P-core R1S processors provide a higher number of PCIe lanes compared to standard Intel® Xeon 6 processor P-core processors.
Notes:
- Risers RC1, RC4, RC6, RC8, RC10, and RC11 support only R1S processors.
- Risers RC2 and RC9 support both R1S and standard single-processor configurations.
- Riser 5b and riser F1a support DPU cards.
Open Compute Project (OCP 3.0) PCIe 5.0 x8/x16
Front I/O
- 1 x USB 2.0 Type - C port (HOST/BMC Direct)
- 1 x USB 2.0 Type A port (optional LCP KVM)
- 1 x Mini-DisplayPort (optional LCP KVM)
- 1 x DB9 Serial
(with front I/O configuration)
- 1 x Dedicated BMC Ethernet port
(with front I/O configuration)
Rear I/O
- 1 x Dedicated BMC Ethernet port
- 2 x USB 3.1 Type A port
- 1 x VGA
Network options
- Up to two OCP NIC card 3.0: 2 slots
on the front or 1 slot at the rear
- OCP Speeds: 100 GbE x 2, 25 GbE x 2, 25 GbE x 4, 10 GbE x 2, 10 GbE x 4,
1 GbE x 4
I/O supports either front or back, not both.
OCP is also supported in front of the system for some configurations, called the Floating OCP Paddle Card (FLOP). Additionally, the Front I/O OCP supports both internal latch and thumbscrew versions, providing flexibility in installation and maintenance.
Boot Options
Supported GPU
Power Supply Units (PSU)
| Form factor |
Output |
Power cord |
| 60 mm |
800 W mixed mode |
C13 |
| 1100 W mixed mode |
C13 |
| 1400 W -48 VDC |
LOTES APOWA048 |
| 1500 W mixed mode |
C13 |
| 1500 W mixed mode 277V |
APP2006G1/2006G3 |
| 1800 W mixed mode |
C13 |
Dimensions & Weight
Dimensions
- Width: 19"
- Length: 32.09"
- Height: 1.69"
Weight
- Diskless 17 kg (37 lbs) 25.2 kg (55.5 lbs)
- 8 x 2.5-inch SATA (HDD/SSD) 25.2 kg (55.5 lbs)
- 16 x 2.5-inch SATA (HDD/SSD) 27.1 kg (59.7 lbs)
- 24 x 2.5-inch SATA (HDD/SSD) 28.6 kg (63.05 lbs)
- 12 x 3.5-inch SATA (HDD/SDD) 31 kg (68.3 lbs)
- 8 x EDSFF E3.S Gen5 NVMe cold aisle configuration. 27.8 kg (61.28 lbs)
- 8 x EDSFF E3.S Gen5 NVMe hot aisle configuration 22.3 kg (49.16 lbs)
- 16 x EDSFF E3.S Gen5 NVMe cold aisle configuration 22.9 kg (50.48 lbs)
- 32 x EDSFF E3.S Gen5 NVMe hot aisle configuration 24.2 kg (53.35 lbs)